US 12,468,098 B2
Optical interposer for chip connection
Ting-Ta Hu, Hsinchu (TW); Po-Yi Wu, Hsinchu (TW); Chieh-Yu Fang, Hsinchu (TW); and Ting-Yan Lin, Hsinchu (TW)
Assigned to FOCI FIBER OPTIC COMMUNICATIONS, INC., Hsinchu (TW)
Filed by FOCI FIBER OPTIC COMMUNICATIONS, INC., Hsinchu (TW)
Filed on May 26, 2023, as Appl. No. 18/202,370.
Claims priority of application No. 112203657 (TW), filed on Apr. 19, 2023.
Prior Publication US 2024/0353632 A1, Oct. 24, 2024
Int. Cl. G02B 6/42 (2006.01); G02B 6/43 (2006.01)
CPC G02B 6/4214 (2013.01) [G02B 6/43 (2013.01)] 3 Claims
OG exemplary drawing
 
1. An optical interposer for chip connection, comprising:
a first total internal reflective layer;
a waveguide, and
a second total internal reflective layer,
wherein:
the optical interposer is grown at a desired position directly above a first photonic integrated circuit chip and a second photonic integrated circuit chip in a semiconductor manufacturing process of the first and second photonic integrated circuit chips to form a light-transmission interface for coupling with the first photonic integrated circuit chip and the second photonic integrated circuit chip; and
refractive indices of the first total internal reflective layer and the second total internal reflective layer are smaller than a refractive index of the waveguide, allowing a light signal to perform repetitive total internal reflections at junctions between materials and advance in a zigzag shape within the waveguide, and further transmit between the first photonic integrated circuit chip and the second photonic integrated circuit chip.