US 12,468,068 B2
Carbon-based conductive film-based ultralight wide-angle absorbing metamaterial with full-frequency absorption within 2-18 GHz and preparation method thereof
Yaqing Liu, Taiyuan (CN); Guizhe Zhao, Taiyuan (CN); and Guanyu Han, Taiyuan (CN)
Assigned to NORTH UNIVERSITY OF CHINA, Taiyuan (CN)
Filed by NORTH UNIVERSITY OF CHINA, Taiyuan (CN)
Filed on Jan. 16, 2025, as Appl. No. 19/024,353.
Application 19/024,353 is a continuation of application No. PCT/CN2024/074018, filed on Jan. 25, 2024.
Claims priority of application No. 202410083767.9 (CN), filed on Jan. 19, 2024.
Prior Publication US 2025/0237786 A1, Jul. 24, 2025
Int. Cl. G02B 1/00 (2006.01); H01Q 17/00 (2006.01)
CPC G02B 1/002 (2013.01) [H01Q 17/007 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A carbon-based conductive film-based ultralight wide-angle absorbing metamaterial with full-frequency absorption within 2-18 GHz, comprising:
a first dielectric substrate;
a first carbon-based conductive film array structure layer;
a second dielectric substrate;
a second carbon-based conductive film array structure layer;
a third dielectric substrate; and
a third carbon-based conductive film array structure layer;
wherein the first dielectric substrate, the first carbon-based conductive film array structure layer, the second dielectric substrate, the second carbon-based conductive film array structure layer, the third dielectric substrate, and the third carbon-based conductive film array structure layer are laminated in sequence with the first dielectric substrate as a bottom;
the first carbon-based conductive film array structure layer is composed of a plurality of first carbon-based conductive film patches each having a square structure in a discrete and periodic arrangement, the second carbon-based conductive film array structure layer is composed of a plurality of second carbon-based conductive film patches each having a square-ring structure in a discrete and periodic arrangement, and the third carbon-based conductive film array structure layer is composed of a plurality of third carbon-based conductive film patches each having a square structure in a discrete and periodic arrangement;
each of the plurality of first carbon-based conductive film patches is made of a carbon-based conductive film with an electric resistivity of 1-3 Ω·cm, an electric conductivity of 0.6-1 S/cm, and a sheet resistance of 200-220 Ω/sq; each of the plurality of second carbon-based conductive film patches and each of the plurality of third carbon-based conductive film patches both are made of a carbon-based conductive film with an electric resistivity of 1-3 Ω·cm, an electric conductivity of 0.4-1 S/cm, and a sheet resistance of 220-260 Ω/sq;
the first carbon-based conductive film array structure layer, the second carbon-based conductive film array structure layer, and the third carbon-based conductive film array structure layer are each arranged in an array of m×n structure units each having a side length P of 50 mm, wherein m and n are each an even number equal to or larger than 4;
each of the m×n structure units of the first carbon-based conductive film array structure layer is one of the plurality of first carbon-based conductive film patches having the square structure; each of the m×n structure units of the second carbon-based conductive film array structure layer is one of the plurality of second carbon-based conductive film patches having the square-ring structure;
each of the m×n structure units of the third carbon-based conductive film array structure layer is a pattern composed of four of the plurality of third carbon-based conductive film patches having the square structure; and
the first dielectric substrate, the second dielectric substrate, and the third dielectric substrate are each a polystyrene foam board with a permittivity of 1-1.1, a loss tangent of 0.018, and a density of 19-21 kg/m3.