US 12,467,953 B2
Probe card
Yuuki Nakamura, Hyogo (JP); Masatoshi Hasaka, Hyogo (JP); and Hiroshi Yamanaka, Hyogo (JP)
Assigned to JAPAN ELECTRONIC MATERIALS CORPORATION, Hyogo (JP)
Appl. No. 18/265,264
Filed by Japan Electronic Materials Corporation, Hyogo (JP)
PCT Filed Mar. 15, 2021, PCT No. PCT/JP2021/010294
§ 371(c)(1), (2) Date Jun. 5, 2023,
PCT Pub. No. WO2022/195648, PCT Pub. Date Sep. 22, 2022.
Prior Publication US 2024/0044942 A1, Feb. 8, 2024
Int. Cl. G01R 1/073 (2006.01)
CPC G01R 1/07342 (2013.01) 9 Claims
OG exemplary drawing
 
1. A probe card comprising:
a wiring board that supports a large number of probes;
a heat-generating film formed on the wiring board; and
a pair of electrode terminals that supplies a current to the heat-generating film,
wherein the heat-generating film is formed on a surface of the wiring board by applying a heat-generating coating material containing fine carbon particles and a binder, and the heat-generating film is exposed on the wiring board.