US 12,467,951 B2
Probe device
Choon Leong Lou, Singapore (SG)
Assigned to TECAT TECHNOLOGIES (SUZHOU) LIMITED, Suzhou (CN)
Filed by TECAT TECHNOLOGIES (SUZHOU) LIMITED, Suzhou (CN)
Filed on Mar. 23, 2023, as Appl. No. 18/188,936.
Claims priority of provisional application 63/333,723, filed on Apr. 22, 2022.
Prior Publication US 2023/0341439 A1, Oct. 26, 2023
Int. Cl. G01R 1/073 (2006.01); G01R 1/067 (2006.01)
CPC G01R 1/07307 (2013.01) [G01R 1/06772 (2013.01); G01R 1/07321 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A probe device, comprising:
a first probe structure, comprising:
a first body;
a first substrate, disposed on the first body; and
a plurality of first probes, electrically connected to the first substrate and protruding from a surface of the first substrate;
a second probe structure, comprising:
a second body, having a plurality of through holes;
a second substrate, disposed on the second body; and
a plurality of second probes, electrically connected to the second substrate, wherein the plurality of second probes protrude from a surface of the second body via the plurality of through holes, respectively; and
a circuit board, wherein the first probe structure is disposed in a first region of the circuit board, and the second probe structure is disposed in a second region of the circuit board, wherein the first region surrounds the second region,
wherein a length of the plurality of first probes is different from a length of the plurality of second probes, and
wherein the first probe structure is free from having a through hole.