US 12,467,949 B2
Cantilever probe card device and light absorption probe
Hao-Yen Cheng, Taoyuan (TW); Rong-Yang Lai, Taoyuan (TW); Chao-Hui Tseng, New Taipei (TW); and Wei-Jhih Su, Taichung (TW)
Assigned to CHUNGHWA PRECISION TEST TECH. CO., LTD., Taoyuan (TW)
Filed by CHUNGHWA PRECISION TEST TECH. CO., LTD., Taoyuan (TW)
Filed on Apr. 11, 2024, as Appl. No. 18/632,316.
Claims priority of application No. 112118434 (TW), filed on May 18, 2023.
Prior Publication US 2024/0385221 A1, Nov. 21, 2024
Int. Cl. G01R 1/067 (2006.01); G01R 1/073 (2006.01)
CPC G01R 1/06761 (2013.01) [G01R 1/06727 (2013.01); G01R 1/07342 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A cantilever probe card device, comprising:
a substrate including a plurality of soldering pads; and
a plurality of light absorption probes fixed onto the substrate and each including:
an arm segment;
a main segment located at one side of the arm segment, wherein the main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction;
a testing segment having an upright shape along the predetermined direction and connected to another side of the arm segment, wherein the testing segment includes a pinpoint portion and an upright portion that connects the pinpoint portion and the arm segment; and
a light absorption coating layer covering the upright portion, wherein the pinpoint portion is exposed from the light absorption coating layer;
wherein, through the light absorption coating layer, the testing segment only forms an observation point at the pinpoint portion in an observation process of a detection apparatus;
wherein the soldering end portions of the main segments of the light absorption probes are respectively fixed onto the soldering pads of the substrate.