| CPC G01R 1/0466 (2013.01) [G01R 31/2886 (2013.01)] | 10 Claims |

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1. A test socket energizably connected to a semiconductor device to electrically test the semiconductor device, the test socket comprising:
a base on which a seating part on which the semiconductor device is seated is formed and a test pin protruding from the seating part in one direction, the test pin contactable with a conductive part of the semiconductor device, and a guide wall for guiding the semiconductor device protrudes upward around the seating part;
a cover configured to reciprocate a first position located at an end of the base in the one direction and a second position located apart from the first position in the one direction; and
a support member coupled to the base and supporting an outer surface of the cover,
wherein the cover comprises:
a cover body:
a through part formed through the cover body in the one direction so that the semiconductor device is seatable in the seating part; and
a first guide part extending from one side of the cover body to an other direction that opposes the one direction, and
wherein the base comprises:
a base body having the seating part formed on one surface of the base body; and
a first guide groove recessed from an outer surface of one side of the base body, wherein the first guide groove is configured to guide motion of the cover in the one direction or the other direction when the first guide part is inserted in the first guide groove, and
wherein the support member comprises a first support part configured to support an outer surface of the first guide part and the outer surface of the one side of the base body while the cover reciprocates between the first position and the second position,
wherein the first support part prevents the cover body from tilting in a direction other than the one direction or the other direction during movement of the cover body.
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