US 12,467,938 B2
Systems and devices for wheel sensors
Wolfgang Schweiker, Weyarn (DE); Simone Fontanesi, Villach (AT); Simon Hainz, Villach (AT); Manfred Schindler, Regensburg (DE); and Michael Weber, Mainburg (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Aug. 3, 2022, as Appl. No. 17/880,020.
Claims priority of application No. 102021120398.8 (DE), filed on Aug. 5, 2021.
Prior Publication US 2023/0041154 A1, Feb. 9, 2023
Int. Cl. G01P 3/481 (2006.01); G01P 1/02 (2006.01); G01P 3/487 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/49 (2006.01); H01L 23/495 (2006.01)
CPC G01P 3/481 (2013.01) [G01P 1/026 (2013.01); G01P 3/487 (2013.01); H01L 23/3107 (2013.01); H01L 23/49 (2013.01); H01L 23/495 (2013.01); H01L 23/562 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wheel sensor arrangement, comprising:
a first wheel speed sensor comprising a first semiconductor die, the first wheel speed sensor configured to provide first data regarding a speed of a rotating wheel;
a second wheel speed sensor comprising a second semiconductor die, the second wheel speed sensor configured to provide second data regarding the speed of the rotating wheel, wherein the second semiconductor die is galvanically isolated from the first semiconductor die; and
a mold housing formed around the first wheel speed sensor and the second wheel speed sensor, the mold housing including a separation feature located between the first wheel speed sensor and the second wheel speed sensor,
wherein the separation feature separates the mold housing into a first region and a second region,
wherein the first wheel speed sensor is located in the first region and the second wheel speed sensor is located in the second region.