US 12,467,742 B2
Film thickness analysis method, film thickness analysis device and storage medium
Masahide Tadokoro, Kumamoto (JP); and Toyohisa Tsuruda, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Appl. No. 18/275,499
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Jan. 28, 2022, PCT No. PCT/JP2022/003352
§ 371(c)(1), (2) Date Aug. 2, 2023,
PCT Pub. No. WO2022/168756, PCT Pub. Date Aug. 11, 2022.
Claims priority of application No. 2021-015734 (JP), filed on Feb. 3, 2021; and application No. 2022-008452 (JP), filed on Jan. 24, 2022.
Prior Publication US 2025/0076028 A1, Mar. 6, 2025
Int. Cl. G01B 11/06 (2006.01)
CPC G01B 11/0625 (2013.01) 12 Claims
OG exemplary drawing
 
1. A film thickness analysis method, comprising:
acquiring film thickness values at a plurality of measurement points different from each other along a radial direction for a target film formed on an analysis target substrate by supplying a processing liquid while rotating the target substrate based on predetermined liquid processing conditions;
creating an approximate expression related to a film thickness distribution of the target film by approximating the film thickness values at the plurality of measurement points with respect to one Zernike polynomial, to estimate an adjustment knob and an adjustment amount of the adjustment knob for correcting film thickness; and
adjusting the liquid processing conditions based on the adjustment knob and the adjustment amount to adjust the film thickness distribution of the target film,
wherein, in the creating the approximate expression, the approximate expression is created by specifying a coefficient related to the film thickness of the entire target substrate and one or more coefficients related to concentric curvature components, among a plurality of coefficients included in the Zernike polynomial.