US 12,467,636 B2
Thermal energy assembly
Per Rosén, Lund (SE); Jacob Skogström, Lomma (SE); Bengt Lindoff, Bjärred (SE); Helen Carlström, Bjärred (SE); and Fredrik Rosenqvist, Helsingborg (SE)
Assigned to E.ON SVERIGE AB, Malmo (SE)
Appl. No. 17/760,442
Filed by E.ON SVERIGE AB, Malmo (SE)
PCT Filed Feb. 9, 2021, PCT No. PCT/EP2021/053046
§ 371(c)(1), (2) Date Aug. 9, 2022,
PCT Pub. No. WO2021/160593, PCT Pub. Date Aug. 19, 2021.
Claims priority of application No. 20157142 (EP), filed on Feb. 13, 2020.
Prior Publication US 2023/0077879 A1, Mar. 16, 2023
Int. Cl. F24D 19/10 (2006.01); F24H 15/144 (2022.01); F24H 15/156 (2022.01); F24H 15/31 (2022.01); F24H 15/335 (2022.01); F24H 15/375 (2022.01); F24H 15/414 (2022.01); F24H 15/238 (2022.01); F24H 15/242 (2022.01); F24H 15/45 (2022.01)
CPC F24D 19/1072 (2013.01) [F24D 19/1081 (2013.01); F24H 15/144 (2022.01); F24H 15/156 (2022.01); F24H 15/31 (2022.01); F24H 15/335 (2022.01); F24H 15/375 (2022.01); F24H 15/414 (2022.01); F24H 15/238 (2022.01); F24H 15/242 (2022.01); F24H 15/45 (2022.01)] 15 Claims
OG exemplary drawing
 
1. A heat pump assembly arranged to be connected to a thermal energy circuit comprising a hot conduit configured to allow thermal fluid of a first temperature to flow therethrough, and a cold conduit configured to allow thermal fluid of a second temperature to flow therethrough, the second temperature is lower than the first temperature, the heat pump assembly comprising:
a thermal heating circuit comprising a thermal heating circuit inlet connectable to the hot conduit and a thermal heating circuit outlet connectable to the cold conduit, the thermal heating circuit is configured to transfer thermal fluid from the thermal heating circuit inlet to the thermal heating circuit outlet, the thermal heating circuit further comprising a thermal heating circuit flow controller configured to control the flow of the thermal fluid from the thermal heating circuit inlet to the thermal circuit outlet;
a heat pump;
a heat pump circuit comprising a heat pump circuit inlet connected to the thermal heating circuit at a first connection point, a heat pump circuit outlet connected to the thermal heating circuit at a second connection point and a heat pump control pump configured to control a flow of thermal fluid from the heat pump circuit inlet through the heat pump at a heat extraction side thereof to the heat pump circuit outlet; and
a heat pump assembly controller configured to control the heat pump assembly based on a parameter associated with an efficiency of the heat pump assembly, wherein the parameter comprises a signal indicative of electric power consumption by the heat pump assembly;
wherein the heat pump circuit and the thermal heating circuit partially overlap, wherein the overlap is between the first and second connection points, and
wherein the heat pump assembly controller is configured to reduce electric power consumption of the heat pump by at least controlling, based on the signal, the heat pump assembly such that the heat pump control pump circulates thermal fluid in the heat pump circuit independently at a higher flow rate or at a lower flow rate than in the thermal heating circuit.