US 12,467,578 B2
Displacement control device for seismic events
Chuan-Chieh Chiang, Hsinchu (TW); and Chun-Jung Hsu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, LTD., Hsinchu (TW)
Filed on Nov. 16, 2023, as Appl. No. 18/511,070.
Application 18/511,070 is a continuation of application No. 17/678,434, filed on Feb. 23, 2022, granted, now 11,852,291.
Prior Publication US 2024/0084954 A1, Mar. 14, 2024
Int. Cl. F16M 9/00 (2006.01); H01L 21/67 (2006.01); F27B 17/00 (2006.01)
CPC F16M 9/00 (2013.01) [H01L 21/67109 (2013.01); F27B 17/0025 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A support platform configured to support at least a portion of the weight of an associated semiconductor manufacturing tool when the associated semiconductor manufacturing tool is disposed on the support platform, the support platform comprising:
a base;
a support plate disposed on the base and configured to move respective to the base;
a brake plate arranged in fixed position respective to the base; and
a damper secured to one of the support plate or the brake plate and frictionally engaging a track of the other of the support plate or the brake plate;
wherein:
the track includes a central track portion which is a planar surface, and inclined track portions extending away from the central track portion on respective first and opposite second sides of the central track portion, and
the inclined track portions are each inclined with respect to the central track portion.