US 12,467,155 B2
Copper plating solution and negative electrode composite current collector prepared using same
Jia Peng, Ningde (CN); Mingling Li, Ningde (CN); Xin Liu, Ningde (CN); and Qisen Huang, Ningde (CN)
Assigned to CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED, Hong Kong (CN)
Filed by CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED, Hong Kong (CN)
Filed on Dec. 14, 2023, as Appl. No. 18/540,081.
Application 18/540,081 is a division of application No. 17/901,101, filed on Sep. 1, 2022, granted, now 11,932,959.
Application 17/901,101 is a continuation of application No. PCT/CN2021/126433, filed on Oct. 26, 2021.
Prior Publication US 2024/0141532 A1, May 2, 2024
Int. Cl. C25D 3/38 (2006.01); C25D 17/10 (2006.01)
CPC C25D 3/38 (2013.01) [C25D 17/10 (2013.01)] 15 Claims
 
1. A method for preparing a negative electrode composite current collector comprising electroplating using a copper plating solution comprising a leveling agent represented by a general formula (1),

OG Complex Work Unit Chemistry
wherein an anion X is F−, Cl−, or Br−;
R1, R2, and R3 are each independently selected from O or S; and
R4, R5, and R6 are each independently selected from hydrogen, a substituted or unsubstituted alkyl, a substituted or unsubstituted vinyl, a substituted or unsubstituted aryl, and a substituted or unsubstituted heteroaryl to form copper layers on two surfaces of a polymer matrix.