US 12,467,130 B2
Temperature-tuned substrate support for substrate processing systems
Norman A. Mertke, San Jose, CA (US); and Himanshu Chokshi, Fremont, CA (US)
Assigned to LAM RESEARCH CORPORATION, Fremont, CA (US)
Filed by Lam Research Corporation, Fremont, CA (US)
Filed on May 10, 2021, as Appl. No. 17/315,998.
Application 17/315,998 is a division of application No. 15/593,987, filed on May 12, 2017, granted, now 11,011,355.
Prior Publication US 2021/0265144 A1, Aug. 26, 2021
Int. Cl. C23C 14/54 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); H01J 37/32 (2006.01)
CPC C23C 14/541 (2013.01) [C23C 16/4586 (2013.01); C23C 16/463 (2013.01); H01J 37/32697 (2013.01); H01J 37/32724 (2013.01); H01J 2237/2065 (2013.01); H01J 2237/335 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A system for controlling a temperature of a substrate during treatment in a substrate processing system, comprising:
a substrate support including:
a first component including an upper surface at least partially defining a center zone;
a second component that is arranged radially outside of and below the first component,
wherein the first component and the second component are spaced apart and define a gap therebetween, and
wherein the second component includes an upper surface at least partially defining a radially-outer zone;
a plurality of height adjustment mechanisms configured to move the first component and to adjust a height of the first component relative to the second component to adjust the gap between the first component and the second component to alter an amount of heat coupling between the first component and the second component;
a first heater configured to heat the first component;
a second heater configured to heat the second component;
a first heat sink having one end in thermal communication with the first component; and
a second heat sink having one end in thermal communication with the second component.