US 12,467,128 B1
Wafer manufacturing apparatus
Ailing Ding, Shanghai (CN); Weibin Huang, Kunshan (CN); Yinxiang Xia, Suzhou (CN); and Markus K. Tilsch, Santa Rosa, CA (US)
Assigned to VIAVI SOLUTIONS SUZHOU CO., LTD., Suzhou (CN)
Filed by Viavi Solutions Suzhou Co., Ltd., Suzhou (CN)
Filed on Jul. 19, 2024, as Appl. No. 18/778,683.
Int. Cl. C23C 14/50 (2006.01); C23C 14/34 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01)
CPC C23C 14/50 (2013.01) [C23C 14/34 (2013.01); H01J 37/32715 (2013.01); H01J 37/3438 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wafer holder apparatus, comprising:
a jig structure to receive a wafer,
wherein the jig structure includes a first angled surface with respect to a nominal coating plane; and
a spring structure to compress an end of the wafer against the first angled surface,
wherein the spring structure includes:
a spring; and
a compression surface attached to the spring,
wherein the compression surface includes a second angled surface matched to the first angled surface, and
wherein the wafer holder apparatus is configured to hold the wafer, such that the wafer is imparted with a pre-coating bias that is an inverse of a post-coating bias.