| CPC C09K 11/665 (2013.01) [C09K 11/02 (2013.01); H10H 20/8512 (2025.01); B82Y 20/00 (2013.01); B82Y 40/00 (2013.01); H10H 20/0361 (2025.01)] | 13 Claims |

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1. A method for producing an optoelectronic semiconductor component, the method comprising:
providing an optoelectronic semiconductor chip comprising at least one light-emitting layer and at least one cavity, wherein the at least one cavity is defined by a base surface extending laterally over a part of a light emission surface of the light emitting layer, and wherein the at least one cavity comprises the light emitting layer as a base; and
introducing at least one precursor of a conversion element in the at least one cavity,
wherein at least one conversion element comprises a perovskite-based ABX3 or A2BB′X6 structure,
wherein, in the perovskite-based ABX3 or A2BB′X6 structure, A is at least one cation selected from the group consisting of methylammonium, formamidinium, K+, Rb+ and Cs+, wherein X is selected from the group consisting of F—, Cl—, Br— and I—, wherein, in case of the ABX3 structure, B is a cation selected from the group consisting of Pb2+, Sn2+ and Ge2+, wherein, in case of the A2BB′X6 structure, B is selected from the group consisting of Bi+ and Ag+, and wherein B′ is Bi+.
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