| CPC C09K 5/10 (2013.01) [H01M 10/0525 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 10/6568 (2015.04); H01M 2220/20 (2013.01)] | 17 Claims |

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1. A thermal management circuit comprising:
a fluid path, a heat exchanger, a pump, and a connecting duct;
a fluid path extending around and/or through a heat source;
a thermal management fluid, disposed in and configured to circulate in the fluid path and to absorb thermal energy produced by the heat source,
wherein the fluid is disposed in the fluid path, the heat exchanger, the pump and the connecting duct;
wherein the thermal management fluid comprises:
a dielectric fluid comprising one or more dielectric substances each selected from C14-C50 alkyls and polyolefins, the dielectric fluid being a Group II, Group III, or Group IV base oil, the dielectric fluid having a kinematic viscosity at 40° C. in the range of 2 to 20 cSt as measured in accordance with ASTM D455, having a flash point less than 150° C. measured in accordance with ASTM D93 and having a dielectric constant of at least 1.5 at 25° C., the dielectric fluid being present in a total amount in the range of 75 wt % to 99.9 wt %; and
one or more fluorocarbons each having a boiling point in the range of 60° C. to 200° C., present in a total amount in the range of 0.1 wt % to 20 wt %,
wherein the one or more fluorocarbons are homogeneously dispersed in the thermal management fluid; and
wherein the thermal management fluid does not have a flash point less than 120° C., measured in accordance with ASTM D93, and the thermal management fluid has a dielectric constant of at least 1.5 at 25° C.
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