US 12,466,956 B2
Electroconductive resin composition and molded article of same
Mutsumi Matsumoto, Tokyo (JP); and Akira Miyama, Tokyo (JP)
Assigned to Denka Company Limited, Tokyo (JP)
Appl. No. 17/268,272
Filed by DENKA COMPANY LIMITED, Tokyo (JP)
PCT Filed Aug. 29, 2019, PCT No. PCT/JP2019/033847
§ 371(c)(1), (2) Date Feb. 12, 2021,
PCT Pub. No. WO2020/045552, PCT Pub. Date Mar. 5, 2020.
Claims priority of application No. 2018-161986 (JP), filed on Aug. 30, 2018.
Prior Publication US 2021/0246314 A1, Aug. 12, 2021
Int. Cl. G09B 23/30 (2006.01); C08L 91/00 (2006.01)
CPC C08L 91/00 (2013.01) [G09B 23/30 (2013.01)] 14 Claims
 
1. An electroconductive resin composition comprising components:
(A) a hydrogenated styrene-based thermoplastic elastomer having a melt flow rate, which is measured at a temperature of 230° C. and a load of 2.16 kg, of 1 g/10 min or less, at 100 parts by mass;
(B) an oil at 100-1,000 parts by mass;
(C) a block copolymer including polyolefin blocks and polyether blocks that are repeatedly and alternately joined, the block copolymer having a melt flow rate, which is measured at 190° C. and a load of 2.16 kg, of 8 g/10 min or more, the polyether blocks having a volume resistivity of 105 to 1011 Ω·cm; and
(D) an ionic liquid,
wherein the component (D) is at a content of 70-250 parts by mass with respect to 100 parts by mass of the component (A), and the component (C) is at a content of 100-200 parts by mass with respect to 100 parts by mass of the component (A).