	US 12,466,952 B2
	Thermally conductive silicone compositions
Aurelie Pelle, Saint Quentin Fallavier (FR); Lucile Fauvre, Lyons (FR); and Julie Dubois, Lyons (FR)
Assigned to Elkem Silicones France SAS, Lyons (FR)
Appl. No. 18/003,206
Filed by Elkem Silicones France SAS, Lyons (FR)
PCT Filed Jun. 24, 2021, PCT No. PCT/FR2021/000066 § 371(c)(1), (2) Date Dec. 23, 2022, PCT Pub. No. WO2021/260279, PCT Pub. Date Dec. 30, 2021.
Claims priority of application No. 2006652 (FR), filed on Jun. 25, 2020.
Prior Publication US 2023/0250283 A1, Aug. 10, 2023
Int. Cl. C08K 3/02 (2006.01); C08J 3/24 (2006.01); C08K 3/22 (2006.01); C08L 83/04 (2006.01)

CPC C08L 83/04 (2013.01) [C08J 3/24 (2013.01); C08K 3/02 (2013.01); C08K 3/22 (2013.01); C08J 2383/07 (2013.01); C08K 2003/023 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01)]

13 Claims

1. An organopolysiloxane composition X comprising:

at least one organopolysiloxane A having per molecule at least two silicon-bonded C₂-C₆alkenyl groups,

at least one organopolysiloxane B having per molecule at least two SiH units,

a catalytically effective amount of at least one hydrosilylation catalyst C, and

a thermally conductive filler D,

wherein

said thermally conductive filler D comprises at least 40% by weight of metallic silicon,

said thermally conductive filler D comprises between 3% and 22% of particles having a diameter of less than or equal to 2 μm, and the particle size distribution is such that the ratio d90/d10 of said filler is greater than or equal to 20.