	US 12,466,937 B2
	Resin composition and use thereof
Qing Wang, Dongguan (CN); Qianfa Liu, Dongguan (CN); Dongliang Liu, Dongguan (CN); Jinchao Dong, Dongguan (CN); Songgang Chai, Dongguan (CN); Yongjing Xu, Dongguan (CN); and Yanhua Zhang, Dongguan (CN)
Assigned to SHENGYI TECHNOLOGY CO., LTD., Dongguan (CN)
Appl. No. 18/575,176
Filed by SHENGYI TECHNOLOGY CO., LTD., Dongguan (CN)
PCT Filed Jul. 27, 2022, PCT No. PCT/CN2022/108221 § 371(c)(1), (2) Date Dec. 28, 2023, PCT Pub. No. WO2023/020222, PCT Pub. Date Feb. 23, 2023.
Claims priority of application No. 202110935223.7 (CN), filed on Aug. 16, 2021.
Prior Publication US 2024/0294731 A1, Sep. 5, 2024
Int. Cl. C08K 3/36 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); C09J 163/00 (2006.01)

CPC C08K 3/36 (2013.01) [C08J 5/247 (2021.05); C08L 63/00 (2013.01); C09J 163/00 (2013.01); C08J 2363/00 (2013.01); C08J 2371/12 (2013.01); C08J 2433/24 (2013.01); C08J 2461/06 (2013.01); C08J 2467/00 (2013.01); C08K 2201/005 (2013.01)]

16 Claims

1. A resin composition, which comprises the following components by weight percentage: 40-70% of a cross-linkable curing resin, and 30-60% of a filler, wherein the filler is silica prepared by organosilicon hydrolysis, the silica has an average particle size D50 of 0.1-3 μm, and the silica has a particle size ratio D100:D10 of less than or equal to 2.5 and greater than or equal to 1.3; wherein the silica has a purity of more than 99.9%.