US 12,466,927 B2
Roll film, method for producing roll film, method for producing copper-clad laminate and method for producing printed board
Seigo Kotera, Chiyoda-ku (JP); Wataru Kasai, Chiyoda-ku (JP); Junetsu Nakamura, Chiyoda-ku (JP); and Takatoshi Yaoita, Chiyoda-ku (JP)
Assigned to AGC Inc., Tokyo (JP)
Filed by AGC Inc., Tokyo (JP)
Filed on Feb. 27, 2024, as Appl. No. 18/588,831.
Application 18/588,831 is a division of application No. 17/021,054, filed on Sep. 15, 2020, abandoned.
Application 17/021,054 is a continuation of application No. PCT/JP2019/016355, filed on Apr. 16, 2019.
Claims priority of application No. 2018-081794 (JP), filed on Apr. 20, 2018.
Prior Publication US 2024/0199829 A1, Jun. 20, 2024
Int. Cl. C08J 5/18 (2006.01); B29C 71/02 (2006.01); B29K 27/18 (2006.01); B29K 105/00 (2006.01); C08F 214/26 (2006.01); C08J 5/12 (2006.01); H05K 1/05 (2006.01); H05K 3/02 (2006.01)
CPC C08J 5/18 (2013.01) [B29C 71/02 (2013.01); C08F 214/265 (2013.01); C08J 5/121 (2013.01); H05K 1/056 (2013.01); H05K 3/022 (2013.01); B29C 2071/022 (2013.01); B29K 2027/18 (2013.01); B29K 2105/0085 (2013.01); C08F 2800/10 (2013.01); C08J 2327/18 (2013.01); H05K 2201/015 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method for producing a roll film, the method comprising:
subjecting a film comprising a melt-processable fluororesin as the main component and having a thickness of from 1 to 100 μm to annealing treatment at from a temperature lower by 210° C. than the melting temperature (Tm) of the melt-processable fluororesin to a temperature lower by 20° C. than Tm and then winding the film,
wherein the roll film comprises a melt-processable fluororesin as the main component, has a thickness of from 1 to 100 μm, and has a dimensional change rate of less than 1.0%, in terms of an absolute value, in each of MD and TD, when heated at 150° C. for 30 minutes and then cooled to 25° C., based on the dimension at 25° C., and
wherein the annealing treatment is carried out with a tension of from 1 to 10 N/m applied to the film.