US 12,466,330 B2
Mounting structure for mounting an electronic device
Jianing Chen, Northville, MI (US); David Jia, Canton, MI (US); and Fan Wu, Shanghai (CN)
Assigned to Harman International Industries, Incorporated, Stamford, CT (US)
Filed by Harman International Industries, Incorporated, Stamford, CT (US)
Filed on Nov. 23, 2022, as Appl. No. 17/993,272.
Prior Publication US 2024/0166142 A1, May 23, 2024
Int. Cl. H05K 7/20 (2006.01); B60R 11/02 (2006.01); B60R 11/00 (2006.01)
CPC B60R 11/0217 (2013.01) [H05K 7/2039 (2013.01); B60R 2011/0042 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A mounting structure comprising:
a base wall formed of a thermally conductive material and configured to provide a thermally conductive pathway between an electronic device mounted to an inner side of the base wall and a panel in contact with an outer side of the base wall that is opposite the inner side, wherein the outer side includes an outer surface and a plurality of bumps configured to engage the panel such that the thermally conductive pathway is formed from the electronic device through the plurality of bumps to the panel, wherein the base wall includes a plurality of tabs, each tab configured to receive a corresponding first fastener to secure the base wall to the panel, wherein each bump includes a distal portion extending outwardly past the outer surface and configured to deform against the panel,
wherein one or more second fasteners extend through a textured region of the base wall and are configured to extend through an electrical component to secure the electrical component to the base wall.