US 12,466,177 B2
Side holding structure and thermal transfer printing device
Min Ai, Changsha (CN); and Wenxiong Huang, Changsha (CN)
Assigned to HUNAN SIJIU TECHNOLOGY CO., LTD, Changsha (CN)
Filed by HUNAN SIJIU TECHNOLOGY CO., LTD, Changsha (CN)
Filed on Jun. 22, 2024, as Appl. No. 18/751,242.
Application 18/751,242 is a continuation of application No. PCT/CN2023/093072, filed on May 9, 2023.
Claims priority of application No. 202221124127.0 (CN), filed on May 11, 2022.
Prior Publication US 2024/0343035 A1, Oct. 17, 2024
Int. Cl. B41F 16/00 (2006.01); B41F 1/54 (2006.01)
CPC B41F 1/54 (2013.01) [B41F 16/00 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A side holding structure, characterized in that the side holding structure comprises:
side openings arranged on two opposite sides of a housing of a thermal transfer printing device, wherein a plurality of snap joints are arranged on edges of the side openings;
holding covers assembled in the side openings, wherein the holding covers comprise a ring mouth portion and a cover wall of a holding groove that is connected to a rear side of the ring mouth portion and concave inward, a plurality of hooks detachably connected to the plurality of snap joints are arranged on an inner side of the ring mouth portion, at least one positioning groove is arranged on a top outside of the cover wall;
at least one inserting portion arranged on a top cover of a top side of the housing and fitted to the positioning groove, wherein the inserting portion is detachably inserted into the positioning groove.