US 12,466,128 B2
Additively manufactured structure and method of manufacturing the same
Jörg Sander, Ulm (DE); Rolf Baltes, Munich (DE); Andreas Salomon, Munich (DE); Felix Zimmer, Erding (DE); and Tobias Hehn, Oberthulba (DE)
Assigned to HENSOLDT Sensors GmbH, Taufkirchen (DE)
Filed by HENSOLDT Sensors GmbH, Taufkirchen (DE)
Filed on Mar. 30, 2022, as Appl. No. 17/708,526.
Claims priority of application No. 21166339 (EP), filed on Mar. 31, 2021.
Prior Publication US 2022/0314536 A1, Oct. 6, 2022
Int. Cl. B29C 64/194 (2017.01); B29C 64/393 (2017.01); H05K 1/02 (2006.01); B29L 31/34 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01)
CPC B29C 64/194 (2017.08) [B29C 64/393 (2017.08); H05K 1/0269 (2013.01); B29L 2031/3425 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12)] 8 Claims
OG exemplary drawing
 
1. A structure including:
a plurality of substructures comprising a first substructure, a second substructure, and at least one electronic component, wherein the first substructure includes a first vernier pattern having a first periodicity, and the second substructure includes a second vernier pattern having a second periodicity that is different than the first periodicity in at least one direction, the first vernier pattern and the second vernier pattern being positioned relative to one another to form a vernier-based position marker;
the vernier-based position marker indicating a relative offset between the first substructure and the second substructure;
wherein the first substructure and the second substructure are comprised of a dielectric material that forms a non-conductive part of the structure where the position marker is provided, the first vernier pattern and the second vernier pattern comprise electrically conductive elements, and the vernier-based position marker being electrically conductive; and
wherein the first vernier pattern and the second vernier pattern each comprise at least one vernier scale to indicate the relative offset in one or both directions (X,Y) perpendicular to an additive manufacturing direction (Z), wherein the at least one vernier scale comprises at least one first side scale on a side surface of the first substructure and at least one second side scale on a side surface of the second substructure, to form at least a portion of the position marker along a lateral boundary of the structure in the X or Y direction, the first vernier pattern being embedded in the first substructure and the second vernier pattern being embedded in the second substructure, wherein the first vernier pattern and the second vernier pattern are in direct contact with each other.