US 12,466,024 B2
Semiconductor substrate grinding apparatus for simultaneous grinding and polishing of backside of wafer
Donghoon Kwon, Suwon-si (KR); and Hyojung Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Dec. 16, 2022, as Appl. No. 18/083,007.
Claims priority of application No. 10-2022-0062907 (KR), filed on May 23, 2022.
Prior Publication US 2023/0373058 A1, Nov. 23, 2023
Int. Cl. B24B 37/34 (2012.01); B08B 3/02 (2006.01); B24B 7/22 (2006.01); B24B 37/10 (2012.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC B24B 37/34 (2013.01) [B08B 3/022 (2013.01); B24B 7/228 (2013.01); B24B 37/107 (2013.01); H01L 21/02016 (2013.01); H01L 21/67051 (2013.01); H01L 21/68764 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A semiconductor substrate grinding apparatus, comprising:
a chuck table configured to mount a semiconductor substrate and fix the semiconductor substrate thereto, so that a back side of the semiconductor substrate faces upwardly and rotates in one direction;
a grinding wheel above the chuck table, and configured to grind the back side of the semiconductor substrate;
a cleaning liquid supplier above the chuck table, spaced apart from the grinding wheel in the one direction, and configured to supply a cleaning liquid to the back side of the semiconductor substrate for cleaning by-products generated by grinding the semiconductor substrate;
a slurry supplier above the chuck table, adjacent to the cleaning liquid supplier in the one direction, and configured to supply a slurry to the back side of the semiconductor substrate;
a polishing wheel above the chuck table, spaced apart from the slurry supplier in the one direction, and configured to perform chemical mechanical polishing on the back side of the semiconductor substrate using the slurry, and
an additional cleaning liquid supplier above the chuck table,
wherein the cleaning liquid supplier is configured to spray the cleaning liquid toward an edge of the semiconductor substrate at an oblique angle with respect to the back side of the semiconductor substrate,
wherein the cleaning liquid supplier comprises:
a cleaning liquid supply unit body that extends in a second direction, that crosses the one direction, to above the chuck table; and
at least one cleaning liquid spray nozzle on a bottom side of the cleaning liquid supply unit body, the at least one cleaning liquid spray nozzle configured to receive the cleaning liquid from the cleaning liquid supply unit body, and spray the cleaning liquid toward the edge of the semiconductor substrate at the oblique angle, and
wherein the additional cleaning liquid supplier comprises:
an additional cleaning liquid supply unit body that extends in a third direction, that is opposite to the second direction, to above the chuck table; and
an additional cleaning liquid spray nozzle on a bottom side of the additional cleaning liquid supply unit body, the additional cleaning liquid spray nozzle configured to receive the cleaning liquid from the additional cleaning liquid supply unit body, and spray the cleaning liquid toward the semiconductor substrate.