US 12,465,956 B2
Substrate processing apparatus and substrate processing method
Junhee Choi, Cheonan-si (KR); Tae-keun Kim, Cheonan-si (KR); Kang Sul Kim, Cheonan-si (KR); Kyeong Min Lee, Cheonan-si (KR); and Yong Jun Kim, Cheonan-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Nov. 21, 2023, as Appl. No. 18/516,821.
Claims priority of application No. 10-2022-0164391 (KR), filed on Nov. 30, 2022.
Prior Publication US 2024/0173752 A1, May 30, 2024
Int. Cl. B08B 13/00 (2006.01); B08B 3/02 (2006.01); B08B 3/08 (2006.01); B08B 3/12 (2006.01); B08B 5/02 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01)
CPC B08B 3/08 (2013.01) [B08B 3/02 (2013.01); B08B 3/12 (2013.01); B08B 5/02 (2013.01); B08B 13/00 (2013.01); H01L 21/02057 (2013.01); H01L 21/67051 (2013.01); B08B 2203/02 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a chamber having a processing space defined therein in which a substrate is processed;
a chuck installed in the processing space and configured to support the substrate thereon;
a chemical liquid supply formed on top of the chuck and configured to supply a chemical liquid droplet toward an upper surface of the substrate supported on the chuck; and
a pressurizer formed on top of the chuck and configured to pressurize the chemical liquid droplet supplied on the upper surface of the substrate so that the pressed chemical liquid droplet fills a gap between patterns formed on the substrate,
wherein the pressurizer includes a pressing plate which is a non-perforated plate and a pressing head configured to press the pressing plate.