US 12,465,913 B2
Droplet sorting chip
Hongbo Zhou, Zhejiang (CN); Ruyuan Song, Zhejiang (CN); and Xiaonan Xu, Zhejiang (CN)
Assigned to Zhejiang Dapu Biotechnology Co., Ltd., Jiaxing (CN)
Filed by Zhejiang Dapu Biotechnology Co., Ltd., Zhejiang (CN)
Filed on Apr. 30, 2022, as Appl. No. 17/734,050.
Claims priority of application No. 202210223357.0 (CN), filed on Mar. 9, 2022; application No. 202210223392.2 (CN), filed on Mar. 9, 2022; application No. 202220494919.0 (CN), filed on Mar. 9, 2022; application No. 202220494926.0 (CN), filed on Mar. 9, 2022; application No. 202220494981.X (CN), filed on Mar. 9, 2022; and application No. 202220495614.1 (CN), filed on Mar. 9, 2022.
Prior Publication US 2023/0285971 A1, Sep. 14, 2023
Int. Cl. B01L 3/00 (2006.01)
CPC B01L 3/502761 (2013.01) [B01L 2200/027 (2013.01); B01L 2200/0652 (2013.01); B01L 2200/14 (2013.01); B01L 2300/08 (2013.01); B01L 2300/0832 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A droplet sorting chip, comprising a cavity area, wherein the cavity area is configured to accommodate impurities that enter into the droplet sorting chip;
wherein the chip further comprises an injection port, the injection port is configured to inject a mixed solution, the mixed solution comprises a droplet and a continuous phase, the cavity area is located downstream of the injection port and is configured to be in fluid communication with the injection port;
wherein the chip comprises a sieve structure, and the sieve structure is located downstream of the injection port, the mixed solution can enter the sieve structure through the injection port;
wherein an end of the sieve structure close to the injection port is configured to form an angular shape, and a periphery of the angular shape is configured to form the cavity area, and an end point of the angular shape is configured to face the injection port, thereby forming an arrangement between the sieve structure, the cavity area and the injection port;
wherein the above arrangement between the sieve structure, the injection port and the cavity area is configured to actively reduce an amount of impurity clogging in the chip.