| CPC A61H 7/007 (2013.01) [A61H 2201/0207 (2013.01); A61H 2201/0214 (2013.01); A61H 2201/0285 (2013.01); A61H 2201/1215 (2013.01); A61H 2201/1481 (2013.01); A61H 2201/1642 (2013.01); A61H 2201/50 (2013.01); A61H 2205/12 (2013.01)] | 18 Claims |

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1. A foot massage device for a foot of a user, comprising:
a housing having an opening;
a pocket assembly which comprises a foot receiving pocket which is coupled to said opening for placing the foot of the user;
a massage assembly disposed in said housing; and
a thermal application assembly which is assembled to said foot receiving pocket, wherein said thermal application assembly comprises a top thermal contact surface which is exposed in said foot receiving pocket, wherein said thermal application assembly has a cooling mode for allowing said top thermal contact surface to provide a cooling treatment to the foot of the user;
wherein said thermal application assembly is configured to deliver localized cooling to a heel of the foot of the user, wherein said foot receiving pocket is made of a flexible material and has a mounting opening, wherein said thermal application assembly is penetrated through said mounting opening to configure said top thermal contact surface be exposed in said foot receiving pocket.
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18. A foot massage device for a foot of a user, comprising:
a housing having an opening;
a pocket assembly which comprises a foot receiving pocket which is coupled to said opening for placing the foot of the user;
a massage assembly disposed in said housing;
a thermal application assembly which is assembled to said foot receiving pocket, wherein said thermal application assembly comprises a top thermal contact surface which is exposed in said foot receiving pocket, wherein said thermal application assembly has a cooling mode for allowing said top thermal contact surface to provide a cooling treatment to the foot of the user; and
a power source, wherein said massage assembly comprises one or more massage heads under said foot receiving pocket and one or more transmission units for coupling with said power source for driving the corresponding massage heads, wherein said massage assembly comprises a top massage plane defined by said one or more massage heads, wherein said top massage plane is higher than said top thermal contact surface of said thermal application assembly.
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