US 12,465,287 B2
Sensing system, smart wearing arrangement and method of fabricating a sensing system
Eric Daniel, Saint Jean le Blanc (FR); François Germain, Poissy (FR); and Simon Vassal, Clichy (FR)
Assigned to LINXENS HOLDING, Mantes-la-Jolie (FR)
Appl. No. 17/799,404
Filed by LINXENS HOLDING, Mantes la Jolie (FR)
PCT Filed Dec. 8, 2020, PCT No. PCT/IB2020/001054
§ 371(c)(1), (2) Date Aug. 12, 2022,
PCT Pub. No. WO2021/161061, PCT Pub. Date Aug. 19, 2021.
Claims priority of application No. 20305139 (EP), filed on Feb. 13, 2020.
Prior Publication US 2023/0076322 A1, Mar. 9, 2023
Int. Cl. A61F 13/00 (2024.01); A61B 5/00 (2006.01)
CPC A61B 5/6828 (2013.01) [A61F 13/00051 (2013.01); A61B 2562/08 (2013.01); A61H 2201/5071 (2013.01); A61H 2201/5079 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A sensing system, comprising: a flexible substrate, at least one sensor device, a chip device, and
at least one electrical line electrically connecting the chip device and the at least one sensor device, wherein the at least one sensor device, the chip device, and the at least one electrical line are integrated into the flexible substrate,
wherein each of the at least one sensor device is formed in an associated sensor portion of the flexible substrate, the chip device is formed in a chip portion of the flexible substrate, and the electrical line is formed in a connecting portion of the flexible substrate, the at least one sensor portion, chip portion and connecting portion being mutually different, and
wherein the flexible substrate further comprises a pattern of cutting lines, each of which partially extends between two adjacent portions of the at least one sensor portion, the chip portion and the connecting portion.
 
12. A method of fabricating a sensing system, comprising:
providing a flexible substrate with at least one sensor device, a chip device, at least one electrical line electrically connecting the chip device and the at least one sensor device, and a pattern of cutting lines, wherein the at least one sensor device, the chip device, and the at least one electrical line are integrated into the flexible substrate, the cutting lines of the pattern of cutting lines partially extending between the chip device, the at least one sensor device and the at least one electrical line,
cutting the pattern of cutting lines, and
separating the chip device, the at least one sensor device and the at least one electrical line along the pattern of cutting lines such that the chip device and the at least one sensing device are spaced apart from each other by a distance corresponding to at least a length of the at least one electrical line extending therebetween,
wherein each of the at least one sensor device) is formed in an associated sensor portion of the flexible substrate, the chip device is formed in a chip portion of the flexible substrate, and the electrical line is formed in a connecting portion of the flexible substrate, the associated sensor portion, the chip portion and the connecting portion being mutually different, and
wherein prior to being cut, each cutting line of the pattern of cutting lines of the flexible substrate extends between two adjacent portions of the at least one sensor portion, the chip portion and the connecting portion.