US 12,465,259 B2
Thin film support structures
Landy Toth, Doylestown, PA (US); and Robert S. Schwartz, Inver Grove Heights, MN (US)
Assigned to LifeLens Technologies, Inc., Ivyland, PA (US)
Filed by LifeLens Technologies, Inc., Ivyland, PA (US)
Filed on Dec. 18, 2023, as Appl. No. 18/543,259.
Application 18/543,259 is a continuation of application No. 16/315,018, granted, now 11,872,043, previously published as PCT/US2017/041291, filed on Jul. 10, 2017.
Claims priority of provisional application 62/362,313, filed on Jul. 14, 2016.
Prior Publication US 2024/0115180 A1, Apr. 11, 2024
Int. Cl. B32B 41/00 (2006.01); A61B 5/05 (2021.01); A61B 5/145 (2006.01); A61B 5/15 (2006.01); A61B 5/25 (2021.01); A61B 5/259 (2021.01); B32B 3/06 (2006.01); B32B 3/08 (2006.01); B32B 3/10 (2006.01); B32B 3/26 (2006.01); B32B 5/18 (2006.01); B32B 7/02 (2019.01); B32B 7/06 (2019.01); B32B 7/10 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 9/06 (2006.01); B32B 25/06 (2006.01); B32B 25/08 (2006.01); B32B 25/10 (2006.01); B32B 25/12 (2006.01); B32B 25/14 (2006.01); B32B 25/16 (2006.01); B32B 25/20 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/10 (2006.01); B32B 27/12 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/40 (2006.01); B32B 29/00 (2006.01)
CPC A61B 5/259 (2021.01) [A61B 5/145 (2013.01); A61B 5/150022 (2013.01); A61B 5/150343 (2013.01); A61B 5/150969 (2013.01); A61B 5/25 (2021.01); B32B 3/06 (2013.01); B32B 3/08 (2013.01); B32B 3/10 (2013.01); B32B 3/26 (2013.01); B32B 3/266 (2013.01); B32B 5/18 (2013.01); B32B 7/02 (2013.01); B32B 7/06 (2013.01); B32B 7/10 (2013.01); B32B 7/12 (2013.01); B32B 9/045 (2013.01); B32B 9/047 (2013.01); B32B 9/06 (2013.01); B32B 25/06 (2013.01); B32B 25/08 (2013.01); B32B 25/10 (2013.01); B32B 25/12 (2013.01); B32B 25/14 (2013.01); B32B 25/16 (2013.01); B32B 25/20 (2013.01); B32B 27/065 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/12 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 27/40 (2013.01); B32B 29/007 (2013.01); A61B 2562/028 (2013.01); A61B 2562/12 (2013.01); A61B 2562/125 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2250/44 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2266/12 (2016.11); B32B 2270/00 (2013.01); B32B 2307/202 (2013.01); B32B 2307/308 (2013.01); B32B 2307/51 (2013.01); B32B 2307/546 (2013.01); B32B 2307/706 (2013.01); B32B 2307/732 (2013.01); B32B 2437/00 (2013.01); B32B 2437/02 (2013.01); B32B 2439/46 (2013.01); B32B 2457/00 (2013.01); B32B 2535/00 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method comprising:
providing a patch, the patch comprising:
a first support structure comprising an adhesive layer formed over a first carrier; and
a film attached to the first support structure and comprising a first pattern of two or more vias formed at least partially therethrough, a first surface of the film being bonded to the adhesive layer of the first support structure, the film being stretchable in at least a first direction along the first surface;
one or more microelectronic structures, the one or more microelectronic structures being at least one of: formed in at least one of the vias; and formed as a pattern on a second surface of the film, the second surface of the film being opposite the first surface of the film;
at least one functional layer formed over the second surface of the film, the at least one functional layer comprising one or more wrinkles enabling stretching of the at least one functional layer in the first direction along the first surface;
a surface adhesive formed over at least a portion of the at least one functional layer; and
a liner attached to the surface adhesive;
wherein the first carrier comprises a material having a rigidity that maintains the first pattern of vias within a given threshold distortion following a given process conducted after the film is attached to the first support structure;
removing at least a portion of the liner to expose at least a first region of the surface adhesive;
attaching the patch to a first structure by bonding the exposed first region of the surface adhesive to a first surface of the first structure; and
removing at least a portion of the first carrier.