US D1,049,867 S
Packaging for foodstuffs
Jung-Wan Ko, Seoul (KR)
Assigned to PALDO CO., LTD., Seoul (KR)
Filed by PALDO CO., LTD., Seoul (KR)
Filed on Jun. 6, 2023, as Appl. No. 29/877,408.
Term of patent 15 Years
LOC (14) Cl. 09 - 05
U.S. Cl. D 9—643  [D9/707]
OG exemplary drawing
 
The ornamental design for a packaging for foodstuffs, as shown and described.