US 12,137,601 B2
In-line monitoring of OLED layer thickness and dopant concentration
Yeishin Tung, San Jose, CA (US); Byung Sung Kwak, Portland, OR (US); Robert Jan Visser, Menlo Park, CA (US); Gangadhar Banappanavar, Durham (GB); and Dinesh Kabra, Mumbai (IN)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 8, 2023, as Appl. No. 18/207,549.
Application 18/207,549 is a continuation of application No. 17/152,689, filed on Jan. 19, 2021, granted, now 11,889,740.
Claims priority of provisional application 62/964,626, filed on Jan. 22, 2020.
Prior Publication US 2023/0320183 A1, Oct. 5, 2023
Int. Cl. H10K 71/00 (2023.01); B05D 1/00 (2006.01)
CPC H10K 71/00 (2023.02) [B05D 1/60 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A metrology chamber for a deposition system, the metrology chamber comprising:
a vacuum chamber;
a support to hold a workpiece in the vacuum chamber;
a workpiece transport system configured to transfer a workpiece into and out of the vacuum chamber under vacuum conditions; and
a metrology system including
an excitation light source to generate an excitation light beam,
a holograph light source to generate a measurement light beam,
one or more optical components to direct the excitation light beam to impinge a layer on the workpiece in the vacuum chamber at an acute angle to induce photoluminescence in the layer and to direct the measurement light beam to impinge the layer on the workpiece on an axis normal to a surface of the workpiece,
a common microscope objective to collect light including reflections of the measurement light beam from the workpiece and photoluminescent emissions from the layer induced by the excitation light beam,
a beam splitter to split the collected light from the common microscope objective into a first beam and a second beam,
one or more sensors positioned to receive the first beam and perform photoluminescence measurements of the layer on the workpiece, and
a digital holographic microscope positioned to receive the second beam and generate a thickness measurement of the layer on the workpiece.