US 12,137,548 B2
Four CPP wide memory cell with buried power grid, and method of fabricating same
Hidehiro Fujiwara, Hsinchu (TW); Chih-Yu Lin, Hsinchu (TW); Yen-Huei Chen, Hsinchu (TW); Wei-Chang Zhao, Hsinchu (TW); and Yi-Hsin Nien, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Jan. 18, 2023, as Appl. No. 18/155,932.
Application 18/155,932 is a continuation of application No. 17/225,627, filed on Apr. 8, 2021, granted, now 11,569,246.
Claims priority of provisional application 63/045,483, filed on Jun. 29, 2020.
Prior Publication US 2023/0156995 A1, May 18, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H10B 10/00 (2023.01); G06F 30/392 (2020.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); G03F 1/70 (2012.01)
CPC H10B 10/12 (2023.02) [G06F 30/392 (2020.01); H01L 23/5226 (2013.01); H01L 23/5286 (2013.01); G03F 1/70 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
first and second write-word lines; and
first and second memory cells, each of which includes:
a latch;
a first pass gate coupled between an input node of the latch and a bit line;
a second pass gate coupled between an output node of the latch and a bit_bar line;
the latch and the first and second pass gates being in a transistor layer; and
gate electrodes of the first and second pass gates being coupled to a corresponding one of the first or second write-word lines;
gate lines which are correspondingly over the transistor layer and which have corresponding long axes extending in a first direction;
for each latch, gate electrodes of transistors included therein being coupled correspondingly to the gate lines; and
the gate lines being organized into first, second, third and fourth sets which are non-overlapping relative to a second direction substantially perpendicular to the first direction, each set including two or more of the gate lines which have substantially collinear long axes; and
each of the first and second memory cells being coupled to a corresponding one of the gate lines in each of the first, second, third and fourth sets such that each of the first and second memory cells is a four contacted poly pitch memory cell; and
power grid lines for the transistors and the pass gates being underneath the transistor layer.