US 12,137,545 B2
Electromagnetic shield of an integrated circuit package
See Yun Yow, Singapore (SG); Kah Hoe Ng, Singapore (SG); and Chien-Shuo Tang, Singapore (SG)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Spring, TX (US)
Filed on Sep. 16, 2022, as Appl. No. 17/932,765.
Prior Publication US 2024/0098952 A1, Mar. 21, 2024
Int. Cl. H05K 9/00 (2006.01); H01L 23/473 (2006.01); H02M 7/00 (2006.01); H05K 7/20 (2006.01)
CPC H05K 9/0088 (2013.01) [H01L 23/473 (2013.01); H02M 7/003 (2013.01); H05K 7/20281 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) package comprising:
a substrate;
a chip coupled to the substrate; and
an electromagnetic shield comprising a cover portion and sidewall portions extending from the cover portion, wherein the sidewall portions are coupled to peripheral end portions of the substrate such that the chip is enclosed between the substrate and the electromagnetic shield, wherein the electromagnetic shield comprises a ferromagnetic material, and wherein the electromagnetic shield protrudes beyond the substrate and is electrically grounded to a printed circuit board of an electronic device to prevent electromagnetic interference (EMI) noise from radiating through the IC package.