| CPC H05K 7/209 (2013.01) [H01F 27/085 (2013.01); H01L 23/367 (2013.01); H02M 1/327 (2021.05)] | 10 Claims |

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1. A power conversion apparatus comprising:
a case having a heat-dissipation property, and including a housing part formed to surround a predetermined space;
a resin material having a thermal conductivity, the resin material being provided in the predetermined space;
a coil disposed in the predetermined space;
a coil case having a shape that fits with the housing part, the coil case being configured to house the coil; and
a power semiconductor device having a first surface and a second surface opposite to the first surface,
wherein the power semiconductor device is disposed between a side wall of the housing part and a side wall of the coil case, and
the first surface contacts the side wall of the housing part, and the second surface contacts the side wall of the coil case.
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