| CPC H05K 7/20154 (2013.01) [G06F 1/206 (2013.01); H05K 7/20127 (2013.01); H05K 7/20145 (2013.01); H05K 7/20418 (2013.01)] | 24 Claims |
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1. A dual mode cooling system, comprising:
electronic heat generating circuitry;
a printed circuit board upon which the electronic heat generating circuitry is located on a first side;
a substantially adiabatic enclosure adapted to house the electronic heat generating circuitry, printed circuit board and other components of the dual mode cooling system;
a finned heat sink adapted to be in thermal contact with the electronic heat generating circuitry, the finned heat sink comprising a plurality of heat radiating fins, each of the plurality of heat radiating fins comprising a plurality of heated surfaces;
a faceplate adapted to enclose the substantially adiabatic enclosure and seal the substantially adiabatic enclosure against an interior wall, and wherein the faceplate comprises—
a cool air intake port adapted to receive cool air from an area external to the substantially adiabatic enclosure and provide the cool air to an interior portion of the substantially adiabatic enclosure, and
a heated air exhaust port adapted to exhaust heated air out of the substantially adiabatic enclosure into an area external to the substantially adiabatic enclosure; and
a fan adapted to receive cool air from the cool air intake port and blow the cool air through the plurality of heat radiating fins of the finned heat sink to remove substantially all of the heat generated by the electronic heat generating circuitry via convection and generate heated air, and wherein the heated air is exhausted through the heated air exhaust port by the fan, and wherein an active cooling path comprises a path of air as it is received from the cool air intake port, passes through the fan, over each of the plurality of heated surfaces, and then is exhausted from the heated air exhaust port, and wherein
the heated air exhaust port is separated with respect to the cool air intake port.
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