US 12,137,530 B2
Method and apparatus for maintaining cooling of modular electronic system during module removal
Rohit Dev Gupta, Bangalore (IN); Joel Richard Goergen, Soulsbyville, CA (US); Sarma V M K Vedhanabhatla, Bangalore (IN); Damaruganath Pinjala, Bangalore (IN); Jatin Kohli, Bangalore (IN); and Robert Gregory Twiss, Chapel Hill, NC (US)
Assigned to CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Sep. 9, 2021, as Appl. No. 17/470,465.
Application 17/470,465 is a division of application No. 16/819,399, filed on Mar. 16, 2020, granted, now 11,172,587.
Application 16/819,399 is a division of application No. 15/639,968, filed on Jun. 30, 2017, granted, now 10,631,424, issued on Apr. 21, 2020.
Prior Publication US 2021/0410312 A1, Dec. 30, 2021
Int. Cl. H05K 7/14 (2006.01); G06F 1/20 (2006.01); H05K 7/02 (2006.01); H05K 7/18 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/1401 (2013.01) [H05K 7/023 (2013.01); H05K 7/1489 (2013.01); H05K 7/20727 (2013.01); H05K 7/20836 (2013.01); G06F 1/20 (2013.01); H05K 7/186 (2013.01); H05K 7/20209 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A computer-implemented method comprising:
receiving a first indication at a modular electronic system of initiation of online removal for a module that is removably inserted into a slot of the modular electronic system;
locking the module in place after the first indication;
increasing a fan speed at the modular electronic system before the module is removed;
monitoring an internal temperature at the modular electronic system; and
providing a second indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on monitoring the internal temperature,
wherein a panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system.