US 12,137,527 B2
Method and device for water intrusion mitigation
Dennis A. Quy, Apple Valley, MN (US); and Curtis Wicks, Shakopee, MN (US)
Assigned to Rosemount Aerospace Inc., Burnsville, MN (US)
Filed by Rosemount Aerospace Inc., Burnsville, MN (US)
Filed on Apr. 14, 2021, as Appl. No. 17/230,281.
Claims priority of provisional application 63/066,957, filed on Aug. 18, 2020.
Prior Publication US 2022/0061172 A1, Feb. 24, 2022
Int. Cl. C25B 9/00 (2021.01); C25B 1/04 (2021.01); C25B 9/19 (2021.01); C25B 15/021 (2021.01); H05K 1/11 (2006.01); H05K 5/02 (2006.01); H05K 7/20 (2006.01)
CPC H05K 5/0213 (2013.01) [C25B 1/04 (2013.01); C25B 9/19 (2021.01); C25B 15/021 (2021.01); H05K 1/115 (2013.01); H05K 5/0217 (2013.01); H05K 7/20 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A water and humidity intrusion mitigation device for use in enclosures housing electronic components or materials sensitive to moisture, the water and humidity intrusion mitigation device comprising:
a thermoelectric cooler comprising:
a first side configured to be heated with the application of an electric current; and
a second side configured to be cooled with the application of an electric current;
a water electrolyzer comprising:
a first printed circuit board having inner and outer sides and comprising a plurality of open vias extending from the inner side to the outer side, the first printed circuit board configured to act as a negative electrode;
a first conductive metal layer disposed on the inner side of the first printed circuit board;
a second printed circuit board disposed on the inner side of the first printed circuit board, the second printed circuit board having inner and outer sides and a plurality of first openings, and being configured to act as a positive electrode;
a second conductive metal layer disposed on the inner side of the second printed circuit board, the second conductive layer having a plurality of second openings aligned with the first openings; and
a proton exchange membrane in thermal communication with the second side of the thermoelectric cooler and disposed between the first and second conductive metal layers, wherein the plurality of first and second openings expose the outer surface of the proton exchange membrane.