US 12,137,526 B2
Bonded body and insulating circuit board
Marina Sakamaki, Saitama (JP); Kenji Kubota, Naka-gun (JP); and Toyo Ohashi, Saitama (JP)
Assigned to MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
Appl. No. 17/915,129
Filed by MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
PCT Filed Mar. 29, 2021, PCT No. PCT/JP2021/013405
§ 371(c)(1), (2) Date Sep. 28, 2022,
PCT Pub. No. WO2021/200874, PCT Pub. Date Oct. 7, 2021.
Claims priority of application No. 2020-060041 (JP), filed on Mar. 30, 2020; and application No. 2020-161017 (JP), filed on Sep. 25, 2020.
Prior Publication US 2023/0164924 A1, May 25, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 3/38 (2006.01)
CPC H05K 3/38 (2013.01) [H05K 1/0284 (2013.01); H05K 2203/06 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A bonded body having a structure in which an insulating resin member made of an insulating resin and a metal part made of a metal are bonded,
wherein a bonded interface between the insulating resin member and the metal part has an uneven shape including a protrusion in which the metal part protrudes toward an insulating resin member side and a recess in which the metal part retracts from the insulating resin member side,
at least one of a kurtosis Rku of contour curve at the bonded interface of the metal part and a kurtosis Sku of contour surface at the bonded interface of the metal part is in a range of 2.75 or more and 6.00 or less, and
an overhang rate that indicates a length ratio of regions overlapping in a lamination direction in a direction along the bonded interface is 7% or more.