US 12,137,523 B1
Interface assembly and method for manufacturing interface assembly
Mikko Heikkinen, Oulunsalo (FI); Jarmo Sääski, Oulunsalo (FI); Ilpo Hänninen, Oulunsalo (FI); Antti Keränen, Oulunsalo (FI); Tomi Simula, Oulunsalo (FI); Vinski Bräysy, Oulunsalo (FI); Pälvi Apilo, Oulunsalo (FI); Pasi Korhonen, Oulunsalo (FI); and Topi Wuori, Oulunsalo (FI)
Assigned to TACTOTEK OY, Oulunsalo (FI)
Filed by TactoTek Oy, Oulunsalo (FI)
Filed on Jul. 17, 2024, as Appl. No. 18/775,176.
Application 18/775,176 is a division of application No. 18/644,647, filed on Apr. 24, 2024, granted, now 12,096,562.
Application 18/644,647 is a division of application No. 18/104,479, filed on Feb. 1, 2023, granted, now 12,004,299, issued on Jun. 4, 2024.
Int. Cl. H05K 1/02 (2006.01); B29C 51/14 (2006.01); G01P 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/14 (2006.01); H05K 3/30 (2006.01); B29L 31/34 (2006.01)
CPC H05K 1/185 (2013.01) [B29C 51/14 (2013.01); G01P 1/02 (2013.01); H05K 3/0014 (2013.01); H05K 3/306 (2013.01); B29L 2031/3425 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10265 (2013.01); H05K 2203/1327 (2013.01); H05K 2203/166 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An interface assembly, comprising a functional multilayer structure comprising:
a first substrate,
a molded material layer on a first side of the first substrate, and
a sensor arrangement comprising at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer; and
a movable member being movable relative to the functional multilayer structure, wherein the movable member comprises at least one detection portion; wherein
the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.