US 12,137,522 B2
Wiring circuit board
Rihito Fukushima, Osaka (JP); Shusaku Shibata, Osaka (JP); and Teppei Niino, Osaka (JP)
Assigned to NITTO DENKO CORPORATION, Osaka (JP)
Appl. No. 17/783,537
Filed by NITTO DENKO CORPORATION, Osaka (JP)
PCT Filed Dec. 15, 2020, PCT No. PCT/JP2020/046742
§ 371(c)(1), (2) Date Jun. 8, 2022,
PCT Pub. No. WO2021/125166, PCT Pub. Date Jun. 24, 2021.
Claims priority of application No. 2019-228698 (JP), filed on Dec. 18, 2019.
Prior Publication US 2023/0015337 A1, Jan. 19, 2023
Int. Cl. H05K 1/05 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 1/05 (2013.01); H05K 1/09 (2013.01); H05K 3/32 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A wiring circuit board comprising:
a mounting region including a terminal, the mounting region which mounts an electronic element to be electrically connected to the terminal, and
a circuit region including a circuit to be electrically connected to the terminal and surrounding the mounting region,
wherein the circuit region includes:
a metal support layer,
a base insulating layer disposed on one surface in a thickness direction of the metal support layer, and
a conductive layer disposed at one side in the thickness direction with respect to one surface in the thickness direction of the base insulating layer and including the circuit;
wherein the mounting region does not include the metal support layer, and includes:
a base insulating layer having an opening portion, and
a conductive layer disposed at one side in the thickness direction with respect to one surface in the thickness direction of the base insulating layer and including the terminal; and
wherein the terminal is disposed in the opening portion of the base insulating layer.