US 12,137,521 B2
Multilayer circuit board
YunLong Qiao, Bukit Timah (SG); Saujit Bandhu, Sengkang (SG); and Kok Hoe Lee, Geylang (SG)
Assigned to 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
Appl. No. 17/800,362
Filed by 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
PCT Filed Feb. 24, 2021, PCT No. PCT/IB2021/051550
§ 371(c)(1), (2) Date Aug. 17, 2022,
PCT Pub. No. WO2021/171200, PCT Pub. Date Sep. 2, 2021.
Claims priority of provisional application 62/982,268, filed on Feb. 27, 2020.
Prior Publication US 2023/0100232 A1, Mar. 30, 2023
Int. Cl. H05K 1/11 (2006.01)
CPC H05K 1/117 (2013.01) [H05K 1/113 (2013.01); H05K 2201/09145 (2013.01); H05K 2201/10189 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A multilayer circuit board extending along a first direction between opposite front and rear edges of the circuit board and comprising:
an upper surface and an opposing lower surface;
an electrically insulating layer disposed between the upper and lower surfaces;
a plurality of electrically conductive upper and lower rear pads disposed proximate the rear edge on the respective upper and lower surfaces for termination of a plurality of wires thereto, the upper and lower rear pads comprising respective upper and lower rear ground pads substantially aligned with each other and configured for termination of ground wires thereto;
a plurality of electrically conductive front pads disposed proximate the front edge for insertion into a connector and electrically connected to the upper and lower rear pads; and
an electrically conductive via extending from the upper rear ground pad to the lower rear ground pad and making electrical and physical contact with each of the upper and lower rear ground pads, wherein the electrically conductive via prevents separation of the upper rear ground pad and the lower rear ground pad from the multiplayer circuit board by extending substantially orthogonally between, and making electrical and physical contact with, the upper rear ground pad and the lower rear ground pad.