US 12,137,520 B1
Educational electronics systems and methods
Andrew S. Cromarty, Palo Alto, CA (US); Donald J. Peterson, Santa Cruz, CA (US); Jasen Levoy, Santa Cruz, CA (US); William Charles Calhoun, Richland, WA (US); David Brainerd, Santa Cruz, CA (US); Ann E. Cromarty, Ottsville, PA (US); and Simon A. Cromarty, Santa Cruz, CA (US)
Assigned to HEATHKIT COMPANY, INC., Ottsville, PA (US)
Filed by HEATHKIT COMPANY, INC., Ottsville, PA (US)
Filed on Nov. 10, 2023, as Appl. No. 18/506,841.
Application 18/506,841 is a division of application No. 16/393,953, filed on Apr. 24, 2019, granted, now 11,864,311.
Claims priority of provisional application 62/662,644, filed on Apr. 25, 2018.
Int. Cl. F24C 7/08 (2006.01); F24C 7/04 (2021.01); G01R 31/28 (2006.01); G09B 23/18 (2006.01); H05K 1/02 (2006.01); H05K 5/02 (2006.01); H05K 7/14 (2006.01)
CPC H05K 1/0295 (2013.01) [F24C 7/046 (2013.01); F24C 7/085 (2013.01); G01R 31/28 (2013.01); G09B 23/185 (2013.01); H05K 1/0266 (2013.01); H05K 5/0217 (2013.01); H05K 7/1402 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system for teaching electronics, comprising:
a printed circuit board configured to accept surface mount device electronics components, said printed circuit board having a silkscreen, said printed circuit board adapted to provide information content in said silkscreen comprising at least one of a schematic diagram, reference data, pictorial information, and ruler scale markings;
said printed circuit board comprising solder pad footprints adapted to accept more than one size of surface mount device electronic component compatibly.