US 12,137,519 B2
Planar lightwave circuit structure based on printed circuit board and manufacturing method thereof
Mingdi Wang, Suzhou (CN); and Zilin Tang, Suzhou (CN)
Assigned to SOOCHOW UNIVERSITY, Suzhou (CN)
Filed by SOOCHOW UNIVERSITY, Suzhou (CN)
Filed on Aug. 30, 2022, as Appl. No. 17/899,169.
Claims priority of application No. 202210099574.3 (CN), filed on Jan. 27, 2022.
Prior Publication US 2023/0240003 A1, Jul. 27, 2023
Int. Cl. H05K 1/02 (2006.01); G02B 6/122 (2006.01); G02B 6/138 (2006.01); G02B 6/12 (2006.01); H05K 3/14 (2006.01); H05K 3/24 (2006.01)
CPC H05K 1/0274 (2013.01) [G02B 6/122 (2013.01); G02B 6/138 (2013.01); G02B 2006/12169 (2013.01); H05K 3/14 (2013.01); H05K 3/243 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A manufacturing method of a planar lightwave circuit structure based on a printed circuit board, comprising:
S1, preparing the printed circuit board;
S2, adhering a lower cladding layer to one side of the printed circuit board, and then carrying out annealing treatment;
S3, jetting a lightwave circuit material on an upper surface of the lower cladding layer in a predetermined route through an electrohydrodynamic jet printing device to form lightwave circuit lines to be cured, wherein the lightwave circuit material is a slurry containing silver ions and an ultraviolet (UV) curing agent;
S4, curing the lightwave circuit lines through irradiation of UV light, wherein the UV light irradiates onto the lightwave circuit lines through a lens assembly with slits, and projection shapes of the UV light are the same as shapes of the lightwave circuit lines, and the UV light does not irradiate to the lower cladding layer; and
S5, depositing an upper cladding layer on the lower cladding layer and the lightwave circuit lines, and then carrying out solidifying treatment.