US 12,137,517 B2
Surface wave launcher for high-speed data links over high-voltage power lines with loss compensation structure
Vishram Shriram Pandit, Bengaluru (IN); Neel Harkishin Bhatia, Mumbai (IN); Rajiv Panigrahi, Bengaluru (IN); Ramaswamy Parthasarathy, Bengaluru (IN); Satish Ramachandra, Bengaluru (IN); Ajay Sharma, Bengaluru (IN); Manish Sharma, Bengaluru (IN); Vaibhavdeep Singh, Chandigarh (IN); Ravichandra Tungani Chikkabasavaiah, Bengaluru (IN); and Jayprakash Thakur, Bengaluru (IN)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 22, 2021, as Appl. No. 17/353,866.
Claims priority of application No. 202041046396 (IN), filed on Oct. 23, 2020.
Prior Publication US 2022/0132654 A1, Apr. 28, 2022
Int. Cl. H05K 1/02 (2006.01); H01P 3/10 (2006.01)
CPC H05K 1/0237 (2013.01) [H01P 3/10 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A surface wave launcher comprising:
a printed circuit board (PCB) comprising:
a conductor pin configured to receive a radio frequency (RF) signal; and
a ground pad;
a cylinder configured to be electrically coupled to the conductor pin and define a cylinder opening, the cylinder configured to:
receive the RF signal from the conductor pin; and
form a transition from coplanar to Goubau line structure with a ground plate structure; and
generate and propagate the surface wave;
an insulator configured to be physically positioned within at least a portion of the cylinder opening and between the cylinder and a portion of a power line, the insulator configured to mechanically isolate the cylinder from the power line and to permit the cylinder to launch the surface wave on the power line; and
the ground plate structure electrically coupled to the ground pad and configured to provide a ground reference for the conductor pin and the cylinder, the conductor pin and the cylinder physically positioned proximate the ground plate structure.