US 12,137,515 B2
Electromagnetic interference shielding and thermal management systems and methods for automotive radar applications
Scott D. Brandenburg, Kokomo, IN (US); David W. Zimmerman, Noblesville, IN (US); and Navneet Gupta, Bangalore (IN)
Assigned to APTIV TECHNOLOGIES AG, Schaffhausen (CH)
Filed by APTIV TECHNOLOGIES LIMITED, St. Michael (BB)
Filed on Mar. 30, 2021, as Appl. No. 17/217,511.
Prior Publication US 2022/0248525 A1, Aug. 4, 2022
Int. Cl. H05K 1/02 (2006.01); G01S 7/02 (2006.01); G01S 13/931 (2020.01); H01L 23/367 (2006.01); H01L 23/552 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01)
CPC H05K 1/0204 (2013.01) [G01S 7/023 (2013.01); G01S 7/028 (2021.05); G01S 13/931 (2013.01); H01L 23/3675 (2013.01); H01L 23/552 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 3/306 (2013.01); H05K 7/205 (2013.01); H05K 9/0049 (2013.01); G01S 2013/93271 (2020.01); H05K 2201/10303 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electromagnetic interference (EMI) shielding and thermal management system for a radar sensor, the system comprising:
a product circuit board (PCB) defining a first aperture defining a first diameter;
an integrated circuit coupled to the PCB;
a shield member directly engaging the integrated circuit and extending to unpopulated areas of the PCB, the shield member defining a second aperture defining a second diameter less than the first diameter, the shield member configured to shield the integrated circuit from EMI and transfer heat energy generated by the integrated circuit away from the integrated circuit; and
a pin member including a first portion defining a first cross-sectional dimension and a second portion defining a second cross-sectional dimension less than the first cross-sectional dimension, the first portion disposed within the first aperture, the second portion disposed within the second aperture, the pin member configured to transfer the heat energy from the shield member to an environment external to the PCB.