US 12,137,156 B2
Physical layer to link layer interface and related systems, methods and devices
Venkat Iyer, Austin, TX (US); Dixon Chen, Guangdong (CN); John Junling Zang, Guangdong (CN); and Shivanand I. Akkihal, Austin, TX (US)
Assigned to Microchip Technology Incorporated, Chandler, AZ (US)
Filed by Microchip Technology Incorporated, Chandler, AZ (US)
Filed on Aug. 30, 2022, as Appl. No. 17/823,384.
Application 17/823,384 is a continuation of application No. 16/653,688, filed on Oct. 15, 2019, granted, now 11,431,468.
Claims priority of application No. 201910785147.9 (CN), filed on Aug. 29, 2019.
Prior Publication US 2022/0416992 A1, Dec. 29, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04L 7/00 (2006.01); H04L 69/323 (2022.01)
CPC H04L 7/0041 (2013.01) [H04L 69/323 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method comprising: starting a data reception from a shared transmission medium;
asserting a signal to indicate that the shared transmission medium is active; detecting a collision at the shared transmission medium; sending delayed receive data to a link layer a first time duration after detecting the collision at the shared transmission medium; after ending the data reception from the shared transmission medium, continuing asserting the signal to indicate the shared transmission medium is active; and before de-asserting a signal to indicate availability of delayed receive data for the link layer, de-asserting the signal to indicate the shared transmission medium is active,
wherein the first time duration is equal to or greater than a time duration of collision handling at the link layer.