US 12,136,983 B2
Front end modules for Wi-Fi acoustic wave resonator RF filter circuits
Jeffrey B. Shealy, Davidson, NC (US); Rohan W. Houlden, Oak Ridge, NC (US); and David M. Aichele, Huntersville, NC (US)
Assigned to Akoustis, Inc., Huntersville, NC (US)
Filed by Akoustis, Inc., Huntersville, NC (US)
Filed on Jun. 22, 2023, as Appl. No. 18/339,796.
Application 18/339,796 is a continuation of application No. 17/544,319, filed on Dec. 7, 2021, granted, now 11,736,177.
Application 17/544,319 is a continuation in part of application No. 17/198,927, filed on Mar. 11, 2021, granted, now 11,394,451, issued on Jul. 19, 2022.
Application 17/198,927 is a continuation in part of application No. 15/931,413, filed on May 13, 2020, granted, now 11,031,989, issued on Jun. 8, 2021.
Application 15/931,413 is a continuation of application No. 16/135,276, filed on Sep. 19, 2018, granted, now 10,673,513, issued on Jun. 2, 2020.
Application 16/135,276 is a continuation in part of application No. 16/019,267, filed on Jun. 26, 2018, granted, now 10,979,022, issued on Apr. 13, 2021.
Application 16/019,267 is a continuation in part of application No. 15/784,919, filed on Oct. 16, 2017, granted, now 10,355,659, issued on Jul. 16, 2019.
Application 15/784,919 is a continuation in part of application No. 15/068,510, filed on Mar. 11, 2016, granted, now 10,217,930, issued on Feb. 26, 2019.
Prior Publication US 2023/0336235 A1, Oct. 19, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 1/02 (2006.01); H03F 1/26 (2006.01); H03F 3/195 (2006.01); H03F 3/72 (2006.01); H03H 3/02 (2006.01); H04B 1/00 (2006.01); H04B 7/08 (2006.01); H03H 9/02 (2006.01); H03H 9/17 (2006.01)
CPC H04B 7/0814 (2013.01) [H03F 1/26 (2013.01); H03F 3/195 (2013.01); H03F 3/72 (2013.01); H03H 3/02 (2013.01); H04B 1/006 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01); H03F 2203/7239 (2013.01); H03H 2003/023 (2013.01); H03H 2003/025 (2013.01); H03H 9/02118 (2013.01); H03H 9/173 (2013.01); H03H 9/175 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A front end module (FEM) device, the device comprising:
a power amplifier (PA) electrically coupled to an input node;
resonator electrically coupled to the PA;
wherein the resonator comprises
a substrate;
a support layer overlying the substrate, the support layer having an air cavity;
a first electrode overlying the air cavity and a portion of the support layer;
a first passivation layer overlying the support layer and being physically coupled to the first electrode;
a piezoelectric film overlying the support layer, the first electrode, and the air cavity, the piezoelectric film having an electrode contact via;
a second electrode formed overlying the piezoelectric film; and
a top metal formed overlying the piezoelectric film, the top metal being physically coupled to the first electrode through the electrode contact via; and
a diversity switch electrically coupled the resonator, an output node, and an antenna.