US 12,136,940 B2
Mobile device case and coating method thereof
Seung Kyun Ryu, Seoul (KR); and Sook Eun Baek, Seoul (KR)
Assigned to IMTECHNOLOGY.CO., LTD, Seongnam-si (KR)
Appl. No. 17/253,489
Filed by IMTECHNOLOGY.CO., LTD, Seongnam-si (KR)
PCT Filed Jan. 8, 2019, PCT No. PCT/KR2019/000284
§ 371(c)(1), (2) Date Dec. 17, 2020,
PCT Pub. No. WO2020/145423, PCT Pub. Date Jul. 16, 2020.
Claims priority of application No. 10-2019-0002282 (KR), filed on Jan. 8, 2019.
Prior Publication US 2021/0266026 A1, Aug. 26, 2021
Int. Cl. H05K 5/04 (2006.01); C23C 18/31 (2006.01); H04B 1/3888 (2015.01); H05K 5/00 (2006.01)
CPC H04B 1/3888 (2013.01) [C23C 18/31 (2013.01); H05K 5/0086 (2013.01); H05K 5/04 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A method for coating a mobile device case for accommodating or covering a substrate and an electronic element located on the substrate, the method comprising:
providing a case frame made of a high molecular material including a resin, wherein the case frame includes:
a cover accommodating or covering the substrate, and
protrusions protruding from the cover to be extended adjacent to the electronic element;
allowing the case frame to be subjected to hot air drying to remove a cleaning agent and water from a surface of the case frame;
allowing the surface of the case frame dried with hot air to be subjected to a cold plasma treatment to introduce polar functional groups to enable plating on the surface of the case frame;
allowing the surface of the case frame to be subjected to a catalystic treatment and an activation treatment for post-processes; and
forming a metal coating layer on the surface of the case frame by electroless plating.