US 12,136,828 B2
Method of fabricating an antenna having a substrate configured to facilitate through-metal energy transfer via near field magnetic coupling
Alberto Peralta, Chicago, IL (US); Md. Nazmul Alam, Glendale Heights, IL (US); Vinit Singh, Austin, TX (US); and Sina Haji Alizad, Chicago, IL (US)
Assigned to NuCurrent, Inc., Chicago, IL (US)
Filed by NuCurrent, Inc., Chicago, IL (US)
Filed on Sep. 18, 2023, as Appl. No. 18/469,040.
Application 18/469,040 is a continuation of application No. 17/888,190, filed on Aug. 15, 2022, granted, now 11,764,614.
Application 17/888,190 is a continuation of application No. 17/145,702, filed on Jan. 11, 2021, granted, now 11,418,063, issued on Aug. 16, 2022.
Application 17/145,702 is a continuation of application No. 15/836,340, filed on Dec. 8, 2017, granted, now 10,892,646, issued on Jan. 12, 2021.
Claims priority of provisional application 62/432,320, filed on Dec. 9, 2016.
Prior Publication US 2024/0266878 A1, Aug. 8, 2024
Int. Cl. H01Q 7/08 (2006.01); H01F 27/36 (2006.01); H01F 38/14 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 1/36 (2006.01); H01Q 1/38 (2006.01); H01Q 7/00 (2006.01); H02J 50/12 (2016.01); H02J 50/70 (2016.01); H04B 5/26 (2024.01); H04B 5/72 (2024.01); H04B 5/79 (2024.01); H05K 5/02 (2006.01); H05K 9/00 (2006.01); H01F 27/34 (2006.01); H02J 7/00 (2006.01)
CPC H02J 50/12 (2016.02) [H01F 27/36 (2013.01); H01F 27/361 (2020.08); H01F 27/363 (2020.08); H01F 27/366 (2020.08); H01F 38/14 (2013.01); H01Q 1/2266 (2013.01); H01Q 1/24 (2013.01); H01Q 1/36 (2013.01); H01Q 1/38 (2013.01); H01Q 7/00 (2013.01); H01Q 7/005 (2013.01); H02J 50/70 (2016.02); H04B 5/26 (2024.01); H04B 5/266 (2024.01); H04B 5/72 (2024.01); H04B 5/79 (2024.01); H05K 5/0247 (2013.01); H05K 9/0084 (2013.01); H01F 2027/348 (2013.01); H01Q 1/248 (2013.01); H02J 7/00034 (2020.01)] 16 Claims
OG exemplary drawing
 
1. An apparatus comprising:
an electrically conductive substrate comprising a first edge and an opposing second edge; and
a transmitter that is (i) positioned proximate to the electrically conductive substrate and (ii) configured to engage in near-field data communication with at least one receiver that is external to the apparatus via inductive coupling,
the electrically conductive substrate further comprising:
a first slit for facilitating the near-field data communication with the at least one receiver, wherein the first slit extends from the first edge of the electrically conductive substrate to a first point within the electrically conductive substrate, and wherein the first slit comprises at least a first segment that is parallel to the first edge and a second segment that is perpendicular to the first edge; and
a second slit for facilitating the near-field data communication with the at least one receiver, wherein the second slit extends from the second edge of the electrically conductive substrate to a second point within the electrically conductive substrate, and wherein the second slit comprises at least a third segment that is parallel to the second edge and a fourth segment that is perpendicular to the second edge.