| CPC H01Q 15/0006 (2013.01) [H01Q 1/2283 (2013.01); H04B 1/18 (2013.01)] | 10 Claims |
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1. A high-frequency circuit comprising:
a first ground layer having an electric conductor formed therein;
a second ground layer having an electric conductor formed therein; and
a conductive pattern layer having a first conductive pattern and a second conductive pattern formed thereon, wherein
the first ground layer, the second ground layer, and the conductive pattern layer are laminated one on another,
a spatial distance from the conductive pattern layer to the second ground layer is longer than a spatial distance from the conductive pattern layer to the first ground layer,
the conductive pattern layer includes a first area in which at least a part of the first conductive pattern is disposed and a second area in which at least a part of the first conductive pattern is disposed,
a cavity is formed in a portion of the first ground layer opposing the first area in a lamination direction in which the first ground layer, the second ground layer and the conductive pattern layer are laminated, and the electric conductor is formed in a portion of the second ground layer opposing the second area in the lamination direction, and
among electrical distance from the first area to the electric conductor formed in the second ground layer and an electrical distance from the second area to the electric conductor formed in the first ground layer, the electrical distance from the first area to the electric conductor formed in the second ground layer is longer, in the lamination direction.
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