US 12,136,759 B2
Antenna-in-package devices and methods of making
HunTeak Lee, Gyeonggi-do (KR); KyoungHee Park, Seoul (KR); KyungHwan Kim, Seoul (KR); SeungHyun Lee, Incheon (KR); and SangJun Park, Incheon (KR)
Assigned to STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed by STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed on Oct. 29, 2021, as Appl. No. 17/452,855.
Prior Publication US 2023/0140748 A1, May 4, 2023
Int. Cl. H05K 1/18 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/552 (2006.01); H01Q 1/22 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01); H01R 12/71 (2011.01)
CPC H01Q 1/2283 (2013.01) [H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/552 (2013.01); H05K 1/181 (2013.01); H05K 3/3436 (2013.01); H01L 23/49816 (2013.01); H01L 25/16 (2013.01); H01R 12/716 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10189 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A method of making a semiconductor device, comprising:
providing a PCB including an antenna formed on a first surface of the PCB;
providing a semiconductor package, including,
a substrate,
an encapsulant deposited over the substrate, and
a shielding layer completely covering a top surface of the encapsulant opposite the substrate and all side surfaces of the semiconductor package, wherein the shielding layer is connected to a ground node through a conductive layer of the substrate;
mounting the semiconductor package onto a second surface of the PCB opposite the first surface; and
disposing an epoxy molding compound (EMC) bump on the first surface of the PCB over the antenna, wherein the EMC bump is electrically insulating.